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THE UNIVERSITY of EDINBURGHDEGREE REGULATIONS & PROGRAMMES OF STUDY 2006/2007
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Microelectronics 3 (U00443)? Credit Points : 20 ? SCQF Level : 9 ? Acronym : EEL-3-ELMEL Microelectronic Devices: The objective of this module is to give students a comprehensive introduction to planar MOS devices, manufacturing technology and simple MOS circuits. The practical exercise that backs up this course is NICEWAY. The NICEWAY computer simulation laboratory is a technology design exercise where a MOS process is designed, using SUPREM, to meet a given specification. Entry Requirements? Pre-requisites : Electronics 2 Electronic Circuits and Devices 2 Subject AreasHome subject areaElectronics, (School of Engineering and Electronics, Schedule M) Delivery Information? Normal year taken : 3rd year ? Delivery Period : Semester 1 (Blocks 1-2) ? Contact Teaching Time : 6 hour(s) per week for 11 weeks First Class Information
Summary of Intended Learning Outcomes
Microelectronic Devices: Understand the theory of MOSFET operation. Reproduce the I-V characteristics of contemporary devices. Follow the manufacturing process sequence for MOS wafers. Know which steps of the manufacturing process affect which characteristics or properties of the finished device, and in what way. Design and optimise simple MOS circuits. Understand the link among device physics, manufacturing process and circuit design; appreciate how, and to what extent, all three contribute to circuit performance.
Gateway: be able to design a shift/add multiplier in verilog; be able to code synchronous state machines in verilog; be able to synthesise digital circuits using verilog; be able to design test code to verify the functionality of a digital circuit; be able to document a design component in a brief form that communicates the important information required to understand and use the design. Niceway: Design a basic fabrication process using the commercial software tools provided. Interpret doping profiles and device cross-sections for an MOS transistor at a point in its fabrication process. Explain qualitatively how and why device properties such as junction depth and sheet resistance will vary with changes in key process variables, and quote typical values for these. Explain the main features of the oxidation and implantation process. Explain why process and device simulation is important in the manufacture of IC's and the limitations and advantages of 1-D, 2-D and 3-D simulators. State the meaning of standard processing terms such as "field oxide", "implant dose", "bird's beak" and "sheet resistance". Assessment Information
Microelectronic Devices - 1.5 hour examination (50%)
Gateway and Niceway - Laboratory based (50%) Exam times
Contact and Further InformationThe Course Secretary should be the first point of contact for all enquiries. Course Secretary Mrs Sian Gowans Course Organiser Dr Brian Flynn School Website : http://www.see.ed.ac.uk/ College Website : http://www.scieng.ed.ac.uk/ |
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